Semiconductor manufacturing equipment "Desktop Flip Chip Bonder"
No clean room needed! A flip chip bonder that makes factory miniaturization possible.
The "Desktop Flip Chip Bonder" enables the construction of a compact semiconductor assembly line without the need for a clean room by combining local clean technology. Since it does not use special chemicals and produces no noise, factories can be established anywhere. With a building the size of a convenience store, it is possible to freely construct a multi-variety, variable production line, allowing for a rapid response to market needs and the establishment of necessary production systems. 【Features】 ○ No clean room required ○ Factory miniaturization is achievable ○ Capable of multi-variety, variable production ○ Realizes Industry 4.0 For more details, please contact us or download the catalog.
- Company：コネクテックジャパン
- Price：Other
